PART |
Description |
Maker |
PS7122A-2A PS7122A-1A PS7122AL-1A PS7122AL-1A-E4 P |
OCMOS FET High Voltage and High Speed power MOSFET and IGBT Half Bridge Driver in a 8-pin DIP package; A IR2308 packaged in a 8-Lead SOIC Dual Low Side Driver, Inverting Input in a 8-pin DIP package; A IR4426 packaged in a 8-Lead SOIC 1200V Half Bridge Driver IC for Power Switching Applications in a 24 Lead SSOP package; A IR2214 packaged in a Lead-Free 24 Lead SSOP FET-OUTPUT OPTOCOUPLER Single High Side Driver, Current Limiting, Programmable Shutdown Error Pin in a 8-pin DIP package; A IR2125 packaged in a Lead-Free 16-Lead SOIC shipped on Tape and Reel Half Bridge Driver, Single Input Plus Inverting Shutdown Pin, Fixed 520ns Deadtime in a 8-pin DIP package; A IR2104 packaged in a Lead-Free 8-Lead PDIP OCMOS场效应管 Optical Coupled MOS FET photocoupler(MOS 场效应管输出光光隔离器) 光纤耦合场效应晶体管光电耦合器(简称MOS场效应管输出光光隔离器
|
NEC, Corp.
|
PS7841C-A11 PS7841C-A15 |
3 Phase Driver, Soft Turn-on, Inverting Input Separate High and Low Side Inputs, 200ns Deadtime.; A IR21366 packaged in a Lead-Free 28-Lead SOIC Single Low Side Driver, Current Limiting, Programmable Shutdown Error Pin in a 8-pin DIP package; A IR2121 packaged in a Lead-Free 8-Lead PDIP
|
NEC, Corp.
|
SMP1321-005LF SMP1321-003LF |
Low Capacitance Plastic Packaged PIN Diodes SILICON, PIN DIODE
|
Skyworks Solutions, Inc.
|
ICS670-02 |
Packaged in 16-pin SOIC
|
Integrated Device Techn...
|
SMP1322 |
Low Resistance, Plastic Packaged PIN Diodes
|
Skyworks Solutions Inc.
|
SMP1302 |
Switch and Attenuator Plastic Packaged PIN Diodes
|
Skyworks Solutions Inc.
|
SMP1302-001 SMP1302-003 SMP1302-006LF SMP1302-003L |
Switch and Attenuator Plastic Packaged PIN Diodes
|
Skyworks Solutions Inc.
|
MAX1169 MAX1169AEUD MAX1169ACUD MAX1169CEUD MAX116 |
58.6ksps / 16-Bit / 2-Wire Serial ADC in a 14-Pin TSSOP 58.6ksps, 16-Bit, 2-Wire Serial ADC in a 14-Pin TSSOP 58.6ksps6位,2线串行ADC采用14引脚TSSOP封装
|
Maxim Integrated Products, Inc.
|
LSP1004 LSP1011 LSP1000 LSP1012 LSP1002 LSP1004-35 |
35 V, SILICON, PIN DIODE ENHANCED PERFORMANCE SURFACE MOUNT EPSM PACKAGED DEVICES 增强性能表面贴装绕流封装器件 ENHANCED PERFORMANCE SURFACE MOUNT EPSM PACKAGED DEVICES
|
MICROSEMI CORP-LOWELL Microsemi, Corp. MICROSEMI[Microsemi Corporation]
|